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HVS30i Integration - 31.08.2021
Standard-Systems

Heat staking application for fixing a circuit boar...

Application 2 - 04.09.2021
Standard-Systems

Typical heat staking head for integration in custo...

Triple Head 2 - 17.04.2020
Applications Standard stand-alone heat staking system with a si
Admin - 07.04.2021
Unfilled frame of plastic heat staked for fixing a printed circuit board. Dom diameter approx 3.6mm. Material PC...
Applications Standard stand-alone heat staking system with a si
Admin - 31.05.2020
Heat staking application for fixing a circuit board in a plastic body. The circuit board is located in an injection moulding p...
Applications Standard stand-alone heat staking system with a si
Admin - 13.01.2021
Heat staking application for fixing a circuit board in a plastic body. The circuit board is located in an injection moulding p...
Applications Standard stand-alone heat staking system with a si
Admin - 26.06.2021
Heat staking application for fixing an LCD display in a plastic body. Two shaped heating dies are moved to plastic edges and fo...
Applications Standard stand-alone heat staking system with a si
Admin - 14.11.2020
Heat staking application for fixing a circuit board in a plastic body. The circuit board is located in an injection moulding p...
Applications Standard stand-alone heat staking system with a si
Admin - 03.03.2020
A greater number of metal plates are fixed in only one single heat staking process. The pins measure approximately 1.3mm, the dome...
Applications Standard stand-alone heat staking system with a si
Admin - 23.05.2021
Plastic Domes fix a circuit board in a plastic component. Material PA6-GF30. Dom diameter about 3,2mm....
Applications Standard stand-alone heat staking system with a si
Admin - 06.02.2020
Classical pin to dom application. Pin diameter before staking around 2,9mnm, Dom about 4.8mm. Material: PEI...
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